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Temperature Profiles via DAQ

Lam® 4520Xle - Temperature Profiles using Noah DAQ

 

Process:

Oxide Etch – 200mm

RF Power:

Varies

T Set-point:

40 °C upper electrode

T Set-point:

10 °C lower electrode

(*) Chiller:

compressor-based chiller vs. Noah POU system

 

The data acquisition equipment set-up is typical. We have documented ESC cooling loop return fluid temperatures only at the request of the customer.

 

Conventional, compressor-based chiller profiles

The fluid temperature profiles below were captured during a production run. This revealing data shows fairly significant fluid temperature variances and fluctuations of the upper and lower loop, per wafer and through-the-lot. This data is very typical of any compressor-based chiller that utilizes a large fluid reservoir and located in the sub-fab:

 

Noah POU chiller system profiles

 

The fluid temperature profiles below were also captured during a production run under “identical conditions” as the previous data-set. This comparative data clearly shows an improvement in fluid temperature stability and uniformity, per wafer and through-the-lot. The data below is a compelling illustration of Dynamic Temperature Control and demonstrates the POU systems ability to “synchronize with the process”…

 

Upper Electrode Results

 

Compressor-based chiller

 

  • non-repeatable temperature profile from the TCU, with drastic temperature fluctuations towards the end of the recipe
  • 5.2 °C drift per wafer (38.4 °C vs. 43.6 °C)

point-of-use chiller

 

  • minimal flucuations during wafer processing
  • improvement ~60% (2.1 °C vs. 5.2 °C)
  • dynamic temperature control

Lower electrode results

 

Compressor-based chiller

 

  • large fluctuations of the fluid temperature are observed during the recipe, with lower electrode temperatures reaching <14 °C
  • 6.3 °C drift per wafer @ 7.8 ~ 14.1 °C

point-of-use chiller

 

  • no major temperature fluctuations
  • improvement ~46% (3.4 °C vs. 6.3 °C)
  • dynamic temperature control

 

 

 
Offering a Complete Range of Thermoelectric Temperature
Control Systems, Including Dynamic Point-of-Use Chillers
for Semiconductor Wafer Processing Equipment.
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