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POU Applications

TEL™

 

Chambers

Platforms

Process

Loops

Model

DRM

Unity II(e) - Unity M(e) - TELIUS

Oxide

Lower electrode

3300 3500

SCCM

Unity II(e)

DT

Lower electrode

3300

Poly

Lower electrode

3300

Oxide

Lower electrode

3500

SCCM

Unity M(e) - TELIUS (SP)

Poly

Upper electrode

3300

Lower electrode

3500

Oxide

Upper electrode

3300

Lower electrode

3500

 

 
Offering a Complete Range of Thermoelectric Temperature
Control Systems, Including Dynamic Point-of-Use Chillers
for Semiconductor Wafer Processing Equipment.
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