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POU therMOstat Application

Temperature Control for MOCVD

 

Noah Precision introduces the “POU therMOstat 8.0*” for use on MOCVD, ALD and other process tools using source bubblers.

 

Conventional open-bath, air-cooled chillers evaporate and condense moisture at or below dew-point temperatures. Moisture released into the tool electronics cabinet can lead to reliability issues with process tool electronics and contribute to temperature drift. The heat exhaust from the most commonly used open-bath chillers also interferes with process tool electronic calibration and stability, leading to poor reliability, higher CoO and increased down-time.

 

Open bath chillers simply do not have adequate temperature control resolution to manage the gas vapor pressures as a function of temperature. The graph below shows an example of TrimethylGallium (TMG) Vapor Pressure vs. Temperature and the potential drift window. Metal organic temperature control is critical to process stability and an essential prerequisite to maintain uniform vapor pressure and evaporation rates.

 

 

  • MO temperature control is critical to process stability
  • Vapor pressure changes due to temperature drift

The Noah POU therMOstat utilizes proven and reliable technology and includes Devicenet communication functionality. This system provides unparalleled reliability, low Cost of Ownership and temperature control accuracy of +0.1 °C.

 

Sizing Kit Options

 

Diameter

Length

Part Number

2 inch single source

Up to 10 inches

903-S2-DIAMETER

3 inch single source

Up to 10 inches

903-S3-DIAMETER

4 inch single source

Up to 10 inches

903-S4-DIAMETER

Dual 2 inch double source

Up to 10 inches

903-D2-DIAMETER

 

Please contact Noah Precision for more information about the POU therMOstat.

 

* POU therMOstat 8.0 Patent Pending

 
Offering a Complete Range of Thermoelectric Temperature
Control Systems, Including Dynamic Point-of-Use Chillers
for Semiconductor Wafer Processing Equipment.
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