Point-of-Use (POU) Chillers for Plasma Etch

POU 3300

The model POU 3300 Point-of-Use Thermoelectric Temperature Control System provides uniform and repeatable temperature control for plasma Etch applications. This system offers dynamic temperature control of the process chamber cathode / electrode / anode and can be synchronized with any Etch process. By using the POU 3300, Etch engineers can independently control the temperature of the process fluid to the wafer chuck at a level of ~0.1 °C which has proven to be a critical process parameter in,<130nm technology nodes. Today, more than 80% of Noah’s Plasma Etch customers use POU 3300 systems, achieving remarkable results in Etch performance, chamber uptime, reducing their Cost of Ownership while increasing “chiller” reliability and creating fab space savings.

POU 3500

POU 3500 Point-of-Use Thermoelectric Temperature Control Systems are ideal solutions for Etch applications that employ high average RF power (heat loads) and/or low wafer temperatures (e.g.: RF Power >2kW, set-point temperature <ambient) The POU 3500 systems have double the cooling capacity than the POU 3300 and offer the same Dynamic Temperature Control benefits. The 3500 system preserves the POU small form factor, and, is thee choice for today’s most demanding 200mm & 300mm Etch processes.

The benefits of Noah POU temperature control systems:

• dynamic temperature control
• smallest footprint in the industry enables POU installations
• low power consumption
• sub-floor tile mount capability
• zero temperature drift
• reliable solid-state operation – only one moving part
• multi-platform interfacing capability
• only 1 gallon of coolant required per loop